Detailed Introduction

Repazole^® PBI Sheet and Rod (P-60 Standard Grade)

Repazole PBI sheet, rod and plate

Product Overview

Polybenzimidazole (PBI) sheet and rod are fabricated from PBI resin through high-temperature and high-pressure molding. While retaining the superior heat resistance of PBI resin, the material also offers resistance to acids and bases, high rigidity, excellent electrical insulation, and self-lubricating characteristics. It can be machined into various specifications and geometries of custom-shaped profiles, and is widely used in semiconductor front-end and back-end processes, aerospace high-temperature load-bearing structures, high-temperature precision structural parts, and insulating components.

Key Features

High-temperature resistance: glass transition temperature up to 425 °C, enabling long-term service at high temperatures;
High strength and high modulus: flexural strength of 250 MPa, compressive strength of 375 MPa, compressive modulus of 4.0 GPa;
Excellent electrical insulation: volume resistivity of 1.0×10¹⁴ Ω·m, relative permittivity of 3.5 (1 MHz), and electric strength: no breakdown at 40 kV (2 mm specimen);
Chemical corrosion resistance: resistant to strong acids, strong bases, and a variety of organic solvents;
High oxygen index: oxygen index up to 58%, with excellent flame-retardant performance.

Grade Portfolio

Grade	Features & typical uses
P-60	Unfilled PBI, standard grade; general high-temperature structural and insulating parts
P-60 SD	High-purity, low-outgassing unfilled grade for the semiconductor industry
P-60 CF	Carbon-fiber reinforced, high strength and high modulus
P-60 ESD	Static-dissipative grade preventing electrostatic build-up during electronics manufacturing

Typical Performance

No.	Performance Item	Unit	Specification	Test Method
1	Flexural Strength	MPa	250	ISO 178:2019
2	Flexural Modulus	MPa	7.0×10³	ISO 178:2019
3	Compressive Strength	MPa	375	ISO 604:2002
4	Compressive Modulus	MPa	4.0×10³	ISO 604:2002
5	Izod Impact Strength (Unnotched)	kJ/m²	36	ISO 180:2023
6	Coefficient of Friction	/	0.244	ISO 6601:2002
7	Heat Deflection Temperature	°C	425	ISO 75-1:2020
8	Glass Transition Temperature	°C	425	ISO 11357-2:2020
9	Coefficient of Linear Expansion (23–150 °C)	μm/(m·°C)	27	ISO 11359-2:2021
10	Oxygen Index	%	58	ISO 4589-2:2017
11	Relative Permittivity (1 MHz)	/	3.5	IEC 62631-2-1:2018
12	Dissipation Factor (1 MHz)	/	0.005	IEC 62631-2-1:2018
13	Insulation Resistance	Ω	7.0×10⁹	IEC 62631-3-3:2015
14	Volume Resistivity	Ω·m	1.0×10¹⁴	IEC 62631-3-1:2023
15	Surface Resistivity	Ω	1.0×10¹³	IEC 62631-3-2:2023
16	Electric Strength (40 kV, 2 mm)	—	No breakdown	IEC 60243-1:2013
17	Density	g/cm³	1.3	ISO 1183-1:2025
18	Rockwell M Hardness	/	125	ISO 2039-2:1987
19	Water Absorption (23 °C, 24 h immersion)	%	0.3	ISO 62:2008

Typical values for selection reference only. Delivery specifications are subject to the product specification confirmed by both parties.

Standard Sizes

Form	Standard sizes	Notes
Sheet	100×100 / 205×140 / 305×305 mm, thickness 5 / 10 / 15 / 20 mm (T5–T20)	Standard sizes in stock; customization available. Final dimensions to be confirmed by both parties.
Rod	Standard φ11×90 mm; custom φ8–φ20 mm, length up to 320 mm

Typical Applications

Semiconductor packaging dies and etch-chamber components, sputtering insulators, high-temperature insulating structures, aerospace heat-resistant parts, chemical corrosion-resistant seals, and precision electronic and electrical components.

Need the full technical datasheet (TDS), grade selection, custom sizes, or a quotation? Contact sales@riebom.com or leave a message below — we reply within one business day.

Repazole^® and Armurex^™ are trademarks of Guangzhou Riebom New Material Technology Research Co., Ltd.